R/flex OPAL

WIPO WIPO 2006

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The International trademark R/flex OPAL was filed as Word mark on 09/28/2006 at the World Intellectual Property Organization.

Trademark Details Last update: September 2, 2022

Trademark form Word mark
File reference 902897
Countries China European Community Japan South Korea Singapore
Base trademark US No. 77003893, September 21, 2006
Application date September 28, 2006
Expiration date July 26, 2010

Trademark owner

7366 North Lincoln Avenue,
Suite 410
US

Trademark representatives

20 Church street, 22nd floor Hartford, CT 06103-3207 US

goods and services

17 Circuit materials, namely, circuit laminates and cover films for use in manufacturing electronic circuitry; circuit materials, namely, laminates used in the production of flexible, printed circuits in a sheet or roll form

Trademark history

Date Document number Area Entry
February 7, 2011 2011/15 Gaz US RAW: Total Ceasing Effect
March 2, 2009 2012/51 Gaz KR Decision on opposition
July 31, 2008 2008/32 Gaz JP Decision on opposition
March 26, 2008 2008/15 Gaz KR Decision on opposition
October 29, 2007 2007/45 Gaz KR Rejection
September 28, 2007 2007/40 Gaz EM RAW: Protection Granted
September 20, 2007 2007/39 Gaz JP Rejection
June 21, 2007 2007/30 Gaz SG RAW: Protection Granted
September 28, 2006 2006/45 Gaz US Registration

ID: 14902897