SEIKABOND

WIPO WIPO 2016

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The International trademark SEIKABOND was filed as Word mark on 03/23/2016 at the World Intellectual Property Organization.

Trademark Details Last update: July 11, 2023

Trademark form Word mark
File reference 1300606
Register number 5273173
Countries China India South Korea United States of America (USA) Vietnam
Base trademark JP No. 5273173, October 16, 2009
Application date March 23, 2016
Expiration date March 23, 2026

Trademark owner

7-6, Nihonbashi Bakuro-cho,
1-chome,
JP

Trademark representatives

c/o Shiga International Patent Office, GranTokyo South Tower, 1-9-2, JP

goods and services

01 Adhesives for plastic films, except for offices or household purposes; adhesives used in industry; synthetic resin adhesives for industrial purposes; chemicals for use in the manufacture of adhesives

Trademark history

Date Document number Area Entry
September 1, 2020 2020/37 Gaz IN Rejection
June 29, 2020 2020/30 Gaz JP Correction
September 6, 2019 2019/39 Gaz CN RAW: Rule 18ter(4) all goods and services protected
October 5, 2017 2017/43 Gaz US RAW: Rule 18ter(2)(ii) GP following a provisional refusal
August 15, 2017 2017/34 Gaz CN Rejection
May 22, 2017 2017/24 Gaz VN Rejection
March 20, 2017 2017/12 Gaz KR Rejection
July 14, 2016 2016/30 Gaz US Rejection
March 23, 2016 2016/25 Gaz JP Registration

ID: 141300606