CEDS+ Logo (USPTO, 03/28/2018)
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The US trademark CEDS+ was filed as Word and figurative mark on 03/28/2018 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE".
| Trademark form | Word and figurative mark |
| File reference | 79235020 |
| Application date | March 28, 2018 |
Trademark owner
Yuseong-gu; Daejeon
goods and services
9
Large scale integrated circuits; integrated circuits for use in digital signal processors (DSP); semiconductor component; computer software for use in processing semiconductor wafers; semi-conductors; semiconductor elements; simulator for semiconductor; semiconductor wafers; electronic semi-conductors; electronic integrated circuits; electronic circuit board; connectors for electronic circuits; integrated circuits; circuit boards provided with integrated circuits; integrated circuit module; chips [integrated circuits]; transistors; printed circuits; circuit boards
ID: 1379235020