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The US trademark ISIP was filed as Word mark on 04/17/2007 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".
| Trademark form | Word mark |
| File reference | 77158668 |
| Application date | April 17, 2007 |
| Publication date | May 13, 2008 |
Trademark owner
26 Chin 3rd Rd.
Kaoshiung
TW
Kaoshiung
TW
Trademark representatives
goods and services
9
Semiconductor device, Product featuring semiconductor package, namely, computer hardware in the nature of wireless access point devices; wafer level package comprising silicon wafers, structured semiconductor wafers
40
Wafer level and single-wafer technology processing, namely, treatment of semiconductor wafers; semiconductor processing, namely, treatment of semiconductor devices
42
Design for others of semiconductor packages, consulting services in the field of semiconductor electro-mechanical engineering
ID: 1377158668