CU.P BOND Logo (USPTO, 10/29/2001)
USPTOProtect this trademark from copycats!
With our trademark monitoring alerts, you are automatically notified by email about copycats and free riders.
The US trademark CU.P BOND was filed as Figurative mark on 10/29/2001 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE".
| Trademark form | Figurative mark |
| File reference | 76330816 |
| Application date | October 29, 2001 |
Trademark owner
Blk 33 Marsiling Industrial Estate Road 3, #03-01/03
739256 Singapore
SG
739256 Singapore
SG
Trademark representatives
goods and services
9
Conductive interconnect on, and extending from, an integrated circuit or semiconductor wafer; flip chip interconnect; pillar bump or interconnect; integrated circuit interconnect
40
Manufacture for others, namely, forming conductive material on an integrated circuit or semiconductor wafer; semiconductor bumping services; electroplating conductive material on integrated circuits or semiconductor wafers; integrated circuit packaging services; pillar bumping services
ID: 1376330816