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The US trademark ATOMIC LAYER CLEAVING was filed as Word mark on 02/02/2000 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE".
| Trademark form | Word mark |
| File reference | 75908736 |
| Application date | February 2, 2000 |
Trademark owner
590 Division Street
95008 Campbell
US
95008 Campbell
US
Trademark representatives
goods and services
9
SUBSTRATES, NAMELY, CONDUCTIVE, SEMI-CONDUCTIVE AND NON-CONDUCTIVE WAFERS AND LAMINATED MULTI-LAYER WAFER
40
CUSTOM MANUFACTURE AND PROCESSING OF SUBSTRATES FOR OTHERS
ID: 1375908736