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The US trademark FOLDMAX was filed as Word mark on 02/03/1994 at the U.S. Patent and Trademark Office.
It was registered as a trademark on 08/06/1996.
The current status of the mark is "CANCELLED - SECTION 8".
| Trademark form | Word mark |
| File reference | 74485973 |
| Register number | 1991625 |
| Application date | February 3, 1994 |
| Publication date | June 27, 1995 |
| Entry date | August 6, 1996 |
Trademark owner
5-2, Marunouchi 2-chome, Chiyoda-ku
Tokyo
JP
Tokyo
JP
Trademark representatives
goods and services
17
flexible and rigid copper clad fiberglass laminate boards for use in the manufacture of multilayer printed wiring circuitboards
ID: 1374485973