European Union Trademark No. 001124304 (Word) Trademark register: EUIPO Status: application refused

Word mark

Solder Ball Interposer
The European Union Trademark for Solder Ball Interposer (Word) was filed on 31.03.1999 for goods and services in class(es) 9 at the European Union Intellectual Property Office (EUIPO). The current status of the trademark No. 001124304 Solder Ball Interposer is 'application refused'.

Trademark information
NameSolder Ball Interposer
RegisterEuropean Union Intellectual Property Office (EUIPO)
Filing date31.03.1999
Nice classes9
 467-8525 Nagoya City, JP
 81925 M√ľnchen, DE
Goods and Services (the trademark is registered for the following goods and services)
Class 9 : Substrates for semi-conductors, glazed substrates for thermal printers, polyimide thin film multilayer substrates, integrated circuit packages for semi-conductors, chip size packages, crystal resonator SAW (Surface Acoustic Wave) filter packages, leadless chip carriers, interposers for semi-conductors, printed circuit boards, flexible printed boards, printed wiring boards, pin grid arrays, ball grid arrays, aluminium nitride products, printed circuits, printed wiring, cerdips, multilayer printed boards.... More
tmdb is a free trademark search website of publicly available records. tmdb does not guarantee nor warrant the accuracy, completeness or timeliness of the data.