TDK TECHNO EXPERIENCE Logo (EUIPO, 02/23/2023)
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The Union trademark TDK TECHNO EXPERIENCE was filed as Figurative mark on 02/23/2023 at the European Union Intellectual Property Office.
It was registered as a trademark on 11/23/2023.
The current status of the mark is "Trademark registered".
Logodesign (Wiener Klassifikation)
#Squares #Rhombs or squares standing on one of the corners thereof #Several quadrilaterals juxtaposed, joined or intersecting #Quadrilaterals containing one or more rounded corners
| Trademark form | Figurative mark |
| File reference | 018836873 |
| Application date | February 23, 2023 |
| Publication date | August 16, 2023 |
| Entry date | November 23, 2023 |
| Expiration date | February 23, 2033 |
Trademark owner
2-5-1 Nihonbashi, Chuo-ku, Tokyo, Japan
Tokyo
JP
Tokyo
JP
Trademark representatives
Arabellastr. 30
81925 München
DE
goods and services
9
Capacitors, inductors (coils); EMC (electromagnetic compatibility) components; RF/SAW (radio frequency/surface acoustic wave) components and modules; voltage protection devices; current protection devices; temperature protection devices; sensors and sensor systems; ceramic switching apparatus; ceramic heating elements; piezoelectric components and buzzers; transformers; ferrites and accessories; noise suppressing/magnetic sheets; anechoic chambers and radio wave absorbers; power supplies; magnets; flash data storage devices; wireless chargers; FA (factory automation) systems; ITO (indium tin oxide) transparent conductive film; micro modules (substrates with built-in ICs [integrated circuits]); HDD (hard disk drive) head; lithium polymer batteries; solar cells; semiconductor embedded in substrate; circuit boards; printed circuit boards; electronic circuit boards; integrated circuit boards; semiconductor boards; circuit embedded boards; printed circuit embedded boards; electronic circuit embedded boards; integrated circuit embedded boards; semiconductor embedded boards; passive component embedded boards; circuit substrates; printed circuit substrates; electronic circuit substrates; integrated circuit substrates; semiconductor substrates; circuit embedded substrates; printed circuit embedded substrates; electronic circuit embedded substrates; integrated circuit embedded substrates; semiconductor embedded substrates; passive component embedded substrates; circuit modules; printed circuit modules; electronic circuit modules; integrated circuit modules; electronic circuit cards; integrated circuit cards; electronic circuit packages; integrated circuit packages; parts and fittings for electric and electronic apparatus, namely, modules incorporated into radio frequency circuits, electrical power supplies, integrated circuits and capacitors; semiconductors; electronic integrated circuits; integrated circuits; large scale integrated circuits; printed circuits; capacitors; multilayer ceramic capacitors; ceramic capacitors; super low distortion multilayer capacitors; variable capacitors; high voltage capacitors; monolithic ceramic capacitors; double layer capacitors; trimmer capacitors; electric resistors; transistors; Lithium-ion batteries; solid-State Batteries; biosensors; computer software for processing vital data; wireless vital data monitoring sensors; IC chips for wireless vital data monitoring sensors; portable vital data monitoring devices with sensors to monitor the vital signs, body temperatures or physical movements of persons wearing or carrying the devices and transmit these data to smart-phones or tablet computers (excluding those for medical use); IC chips for portable vital data monitoring devices; computer software for portable vital data monitoring devices; transparent conductive film; transparent conductive plates; film solar cells
ID: 11018836873