6dVerse

EUIPO EUIPO 2021 Trademark registered

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The Union trademark 6dVerse was filed as Word mark on 12/10/2021 at the European Union Intellectual Property Office.
It was registered as a trademark on 09/16/2022. The current status of the mark is "Trademark registered".

Trademark Details Last update: February 8, 2024

Trademark form Word mark
File reference 018618712
Application date December 10, 2021
Publication date June 9, 2022
Entry date September 16, 2022
Expiration date December 10, 2031

Trademark owner

No. 6, Technology Road 5
30078 Hsinchu
TW

Trademark representatives

goods and services

9 Chips having multi-well arrays that can be used in chemical analysis, biological analysis or patterning for scientific, laboratory or medical research use; Semiconductor chips or chipsets for use in enabling memory, multiway communications and processing capabilities; known good die memory (KGDM); known good die; known good die memory; DRAM module; specialty DRAM; automotive DRAM; industrial DRAM; micro circuits; micro integrated circuits; electronic circuits; semiconductor components; chips; computer memory; computer memory devices; Integrated circuits and integrated circuit cores for use in wireless communications and wireless communication equipment and apparatus and digital signal processors (DSP); Integrated circuit modules; Electronic integrated circuits; Decision circuits; Large scale integrated circuits; Circuits for heavy current; Cards with integrated circuits; Microcircuits; Very large scale integration (VLSI) semiconductor integrated circuits; Electric and electronic circuits; Design libraries, namely, downloadable electronic data files for use in integrated circuit and semiconductor design; Electronic components in the nature of semiconductors and integrated circuits; Wafers for integrated circuits; Integrated circuit cards and components; Flexible circuit boards; Dynamic random access memory (DRAM); Computer software in the field of collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition, and VR (Virtual Reality), AR (Augmented Reality) and MR (Mixed Reality); Electronic hardware and software for use in collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition; Electronic security apparatus and surveillance apparatus; Software and electronic hardware utilizing eye and gesture tracking technology; Algorithm software programs for collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition; Semiconductor chip sets for use in enabling image signal processing; Integrated circuits and integrated circuit cores for use in image signal processing; Chipsets; Semiconductor chip sets; Microchips (computer hardware); Silicon chips; Semiconductor chips; Multiprocessor chips; Computer chips; integrated circuits (IC); computer hardware; computer components; computer circuits; Semiconductors; Semiconductor devices; Semiconductor wafers; Chips, chip sets, and modules for 3D sensing (collection of information in 3D dimension), 3D sensor fusion and 3D perception (reactions and decisions made based on collected information)
42 Design of integrated circuits; Design of computer hardware, integrated circuits, communications hardware and software and computer networks for others; Development of technologies for the fabrication of circuits for wireless communication, electronic data processing, consumer electronic, automotive electronics; Design for others of integrated circuits and integrated circuit cores for use in wireless communications and wireless communication equipment and apparatus and digital signal processors (DSP); Research, development, and design of various electronic products and semiconductor products, including known good die, known good die memory, dynamic random access memory, DRAM modules, integrated circuits, micro circuits, micro integrated circuits, electronic circuits, semiconductor, semiconductor components, semiconductor chips, computer hardware, computer memory, computer memory devices, and computer components; Structure design for semiconductor products, including known good die, known good die memory, dynamic random access memory, DRAM modules, integrated circuits, micro circuits, micro integrated circuits, electronic circuits, semiconductor, semiconductor components, semiconductor chips, computer hardware, computer memory, computer memory devices, and computer components; Testing and consulting of various electronic products and semiconductor products, including known good die, known good die memory, dynamic random access memory, DRAM modules, integrated circuits, micro circuits, micro integrated circuits, electronic circuits, semiconductor, semiconductor components, semiconductor chips, computer hardware, computer memory, computer memory devices, and computer components; Quality inspection, testing and identification of semiconductor products, including known good die, known good die memory, dynamic random access memory, DRAM modules, integrated circuits, micro circuits, micro integrated circuits, electronic circuits, semiconductor, semiconductor components, semiconductor chips, computer hardware, computer memory, computer memory devices, and computer components; Research in the area of semiconductor processing technology; Design and development of automated controller systems, namely, temperature, humidity and electrical controllers; Development and implementation of software for testing of electronic components and electronic systems; Development of electronic hardware; Development and implementation of software for productization of electronic components and electronic systems; Development of electronic hardware; Development of technology in the field of semiconductor process for the purpose of productization of electronic components and electronic systems

ID: 11018618712