SMIC Logo (EUIPO, 11/07/2016)
EUIPOProtect this trademark from copycats!
With our trademark monitoring alerts, you are automatically notified by email about copycats and free riders.
The Union trademark SMIC was filed as Figurative mark on 11/07/2016 at the European Union Intellectual Property Office.
It was registered as a trademark on 06/16/2017.
The current status of the mark is "Trademark registered".
Logodesign (Wiener Klassifikation)
#Moiré surfaces or backgrounds, marble, degrading surfaces, wooden-like surfaces, rainbow colours surfaces #One line or one band #Curved lines or bands (except A 26.11.13) #Red, pink, orange #Orange
| Trademark form | Figurative mark |
| File reference | 016008674 |
| Application date | November 7, 2016 |
| Publication date | February 28, 2017 |
| Entry date | June 16, 2017 |
| Expiration date | November 7, 2026 |
Trademark owner
No. 18, Zhangjiang Road, Pudong New Area
201203 Shanghai
CN
201203 Shanghai
CN
Trademark representatives
Destouchesstr. 68
80796 München
DE
goods and services
9
Semiconductors and integrated circuits; semiconductors and integrated circuits, namely, application-specific integrated circuits, logic chips, mixed signal chips and memory chips; parts and chip packaging for semiconductors and integrated circuits, namely, application-specific integrated circuits, logic chips, mixed signal chips and memory chips; packaged semiconductors and integrated circuits, namely, application-specific integrated circuits, logic chips, mixed signal chips and memory chips; photo masks; integrated circuit cards and boards; wafers, namely, those comprising germanium/silicon; transistors; magnetic coded cards for use in consumer electronic products; printed circuits; blank smart cards and SIM cards for use in consumer electronic products; micro-display devices, namely, liquid crystal displays on silicon panel; epoxy probe cards for use in testing
39
Wafer, semiconductor and integrated circuit packaging services to the order and/or specification of others
40
Custom manufacture of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices; manufacture of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, to the order and/or specification of others; wafer, semiconductor and integrated circuit manufacturing and assembling services to the order and/or specification of others; semiconductor and integrated circuit cutting, molding and etching to the order and/or specification of others; integrated circuit wafer foundry services to the order and/or specification of others; integrated circuit photo mask and electronic chip or computer chip manufacturing to the order and/or specification of others; wafer, chip and semiconductor manufacturing to the order and/or specification of others, integrated circuit assembling services to the order and/or specification of others; silicon wafer photo-lithography, etching, thin film, diffusion, ion implanting and chemical mechanical polishing services to the order and/or specification of others; manufacture of printed circuits to the order and/or specification of others; photo mask manufacturing services to the order and/or specification of others; manufacture of micro-display devices, including liquid crystal on silicon devices, to the order and/or specification of others; manufacture of smart cards and SIM cards to the order and/or specification of others
42
Design of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, for others; custom design of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, to the specification of others; simulation, namely, testing, verification and analysis of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, for others; design of printed circuits for others; photo mask design services for others; design of micro-display devices, including liquid crystal on silicon devices, for others; design of smart cards and SIM cards for others; wafer probing services to the order and/or specification of others
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| May 22, 2017 | Change Representative, Registered |
ID: 11016008674