European Union Trademark No. 002423812 (Figurative) Trademark register: EUIPO Status: registered

 
KS Logo

Logo design: Monograms formed of intertwined, overlapping or otherwise combined letters ; ;

The European Union Trademark for KS (Figurative) was filed on 24.10.2001 for goods and services in class(es) 9, 35, 37, 40, 41 and 42 at the European Union Intellectual Property Office (EUIPO). The current status of the trademark No. 002423812 KS is 'registered'.


 
Trademark information
NameKS
TypeFigurative
RegisterEuropean Union Intellectual Property Office (EUIPO)
 
Filing date24.10.2001
Registration date19.09.2003
Expiry date24.10.2011
 
Nice classes9, 35, 37, 40, 41 and 42
OwnerKULICKE & SOFFA INVESTMENTS, INC.
 19808 Wilmington,, Delaware, US
 
RepresentativeURQUHART-DYKES & LORD LLP
 CF10 2HH Cardiff, GB
 
Goods and Services (the trademark is registered for the following goods and services)
Class 9 : Apparatus, equipment and tools for assembling, manufacturing, treating and producing electrical and electronic apparatus and components; semiconductor fabrication apparatus, equipment and tools; computer software and hardware; automatic wire bonding equipment, tools and materials; bonder software; die attachment equipment; dicing equipment and blades; factory automation software; manual wire bonding equipment; solder ball placement equipment; wafer bumping equipment; wafer preparation equipment; wafer test products; package test products; and electrical circuit substrates; parts and fittings for the aforesaid goods.... More
Class 35 : The bringing together, for the benefit of others, of a variety of goods connected with the assembly, manufacture and production of electrical and electronic apparatus and components, enabling customers to conveniently view and purchase those goods; business services in the field of the assembly, manufacture and production of electrical and electronic apparatus and components; business advisory and consultancy services in the field of the assembly, manufacture and production of electrical and electronic apparatus and components; providing on-line information regarding products and services available for back-end assembly of semiconductors; providing on-line electronic commerce services, namely, on-line catalogue for selection, ordering and payment of products and services, namely, automatic wire bonding equipment, tools and materials, bonder software, die attachment equipment, dicing equipment and blades, factory automation products and services, electrical circuit substrates, manual wire bonding equipment, solder ball placement equipment, wafer bumping equipment, wafer bumping services, wafer preparation equipment, wafer test products and package test products; and customer support services relating thereto, namely, supply, logistics and support, factory productivity, training and equipment refurbishment, on-line customer-specific product design, on-line marketplace for customers and suppliers, and on-line customer specific portal, all in the field of back-end assembly of semiconductors.... More
Class 37 : Maintenance and refurbishment of apparatus, equipment and tools for assembling, fabricating, manufacturing, treating and producing electrical and electronic apparatus and components; maintenance and refurbishment of equipment used in the back-end assembly of semiconductors.
Class 40 : Custom assembly and fabrication (manufacturing) services for producing electrical and electronic apparatus and components; custom assembly and fabrication (manufacturing) services for front-end assembly of semiconductors.
Class 41 : Customer training in use of apparatus, equipment and tools for assembling, fabricating, manufacturing, treating and producing electrical and electronic apparatus and components; customer training in use of equipment for back-end assembly of semiconductors.
Class 42 : Custom design services for producing electrical and electronic apparatus and components; providing technical information in the field of the production of electrical and electronic apparatus and components; customer support services relating to use of apparatus, equipment and tools for assembling, fabricating, manufacturing, treating and producing electrical and electronic apparatus and components and spare parts therefor; custom design services for front-end assembly of semiconductors; wafer bumping services, namely, manufacturing technology for placing solders directly onto semiconductor wafers; providing technical information in the field of back-end assembly of semi-conductors; customer support services relating to use of equipment, design changes, and spare parts for back-end assembly of semiconductors.... More
 
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