European Union Trademark No. 001124304 (Word) Trademark register: EUIPO Status: application refused

 
Word mark

Solder Ball Interposer
The European Union Trademark for Solder Ball Interposer (Word) was filed on 31.03.1999 for goods and services in class(es) 9 at the European Union Intellectual Property Office (EUIPO). The current status of the trademark No. 001124304 Solder Ball Interposer is 'application refused'.


 
Trademark information
NameSolder Ball Interposer
TypeWord
RegisterEuropean Union Intellectual Property Office (EUIPO)
 
Filing date31.03.1999
 
Nice classes9
OwnerNGK SPARK PLUG CO., LTD.
 467-8525 Nagoya City, JP
 
RepresentativeHOFFMANN · EITLE PATENT- UND RECHTSANWÄLTE PARTMBB
 81925 München, DE
 
Goods and Services (the trademark is registered for the following goods and services)
Class 9 : Substrates for semi-conductors, glazed substrates for thermal printers, polyimide thin film multilayer substrates, integrated circuit packages for semi-conductors, chip size packages, crystal resonator SAW (Surface Acoustic Wave) filter packages, leadless chip carriers, interposers for semi-conductors, printed circuit boards, flexible printed boards, printed wiring boards, pin grid arrays, ball grid arrays, aluminium nitride products, printed circuits, printed wiring, cerdips, multilayer printed boards.... More
 
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