European Union Trademark No. 001124304 (Word) Trademark register: EUIPO Status: application refused
Solder Ball Interposer
The European Union Trademark for Solder Ball Interposer (Word) was filed on 31.03.1999 for goods and services in class(es) 9 at the European Union Intellectual Property Office (EUIPO). The current status of the trademark No. 001124304 Solder Ball Interposer is 'application refused'.
|Name||Solder Ball Interposer |
|Register||European Union Intellectual Property Office (EUIPO)
Goods and Services (the trademark is registered for the following goods and services)
Class 9 : Substrates for semi-conductors, glazed substrates for thermal printers, polyimide thin film multilayer substrates, integrated circuit packages for semi-conductors, chip size packages, crystal resonator SAW (Surface Acoustic Wave) filter packages, leadless chip carriers, interposers for semi-conductors, printed circuit boards, flexible printed boards, printed wiring boards, pin grid arrays, ball grid arrays, aluminium nitride products, printed circuits, printed wiring, cerdips, multilayer printed boards.... More
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