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The International trademark HISET was filed as Word mark on 10/08/2008 at the World Intellectual Property Organization.
| Trademark form | Word mark |
| File reference | 992842 |
| Countries | 
|
| Base trademark |
No. 2008-70657,
August 28, 2008
|
| Application date | October 8, 2008 |
| Expiration date | October 8, 2028 |
Trademark owner
Trademark representatives
8-2, Kanda-sudacho 2-chome,
Chiyoda-ku
JP
goods and services
01
Unprocessed plastics (plastics in primary form);
photo-curing resins; liquid photosensitive resins, epoxy
resins; epoxy resins, unprocessed; photographic chemicals,
emulsions, dry plates, paper, fixers and other photographic
chemicals included in this class; photosensitive resin
films; photosensitive resin films for manufacturing printed
wiring boards
17
Plastic semi-worked products (for use as material); plastic
photosensitive plates coated with synthetic resins;
adhesive-coated plastic films or sheets; synthetic resins as
sheets (semi-processed); sheets of synthetic resins;
pressure sensitive adhesive-coated sheets of synthetic
resins; copper-laminated plastic boards for use as material
for printed wiring boards, copper-laminated plastic boards
coated with epoxy resins; flexible laminated boards for
printed circuit substrate, copper-laminated boards of
plastic for printed circuit substrate; transparent plastic
films for use as thermal insulation material, insulating
plastic films; thermal insulating laminated boards of
plastic to be fit for use as substrate
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| October 8, 2018 | 2018/41 Gaz | Extension | |
| April 14, 2010 | 2010/15 Gaz | EM | Rejection |
| February 22, 2010 | 2010/9 Gaz | KR | Rejection |
| October 8, 2008 | 2009/8 Gaz | JP | Registration |
ID: 14992842