SPM

WIPO WIPO 2008

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The International trademark SPM was filed as Figurative mark on 05/13/2008 at the World Intellectual Property Organization.

Logodesign (Wiener Klassifikation)

#Lines, bands #Letters presenting a special form of writing #Curved lines or bands (except A 26.11.13) #Letters linked to a figurative element

Trademark Details Last update: October 8, 2018

Trademark form Figurative mark
File reference 983081
Countries China European Community Japan South Korea
Base trademark US No. 77328177, November 13, 2007
Application date May 13, 2008
Expiration date May 13, 2028

Trademark owner

15 Mercedes Dr.
Montvale NJ 07645
US

Trademark representatives

2635 Camino Del Rio South, Suite 102 US

goods and services

09 Electrical wire, ribbon, strips, and tape; power wire; lead free solders in the electronics industry; microelectronic packages and package components, namely, lids, covers, semiconductor integrated circuit chip carriers and housings
39 Electronic component packaging for use in automated equipment
40 Electrical wire, ribbon, strip and tape fabrication for others in the field of electronics; custom metal rolling, extrusion, pressing, stamping, casting, sphere formation, and cladding to the order and specification of others; custom production services in the field of microelectronics and semiconductor integrated circuit chip packaging

Trademark history

Date Document number Area Entry
July 31, 2018 2018/33 Gaz Extension
June 3, 2010 2013/3 Gaz JP RAW: Rule 18ter(2)(ii) GP following a provisional refusal
May 3, 2010 2013/3 Gaz KR RAW: Rule 18ter(2)(ii) GP following a provisional refusal
December 17, 2009 2009/52 Gaz JP Rejection
October 19, 2009 2010/2 Gaz EM Rejection
September 14, 2009 2009/39 Gaz CN Rejection
August 10, 2009 2009/34 Gaz KR Rejection
July 30, 2009 2009/36 Gaz JP Rejection
May 13, 2008 2008/47 Gaz US Registration

ID: 14983081