oerlikon esec Logo (WIPO, 02/06/2008)
WIPOProtect this trademark from copycats!
With our trademark monitoring alerts, you are automatically notified by email about copycats and free riders.
The International trademark oerlikon esec was filed as Figurative mark on 02/06/2008 at the World Intellectual Property Organization.
Logodesign (Wiener Klassifikation)
#Letters presenting a special form of writing #Colours #Series of letters in different dimensions #Red, pink, orange
| Trademark form | Figurative mark |
| File reference | 965985 |
| Register number | 30751625.3/09 |
| Countries | 
|
| Base trademark |
No. 307 51 625.3/09,
December 17, 2007
|
| Application date | February 6, 2008 |
| Expiration date | February 6, 2018 |
Trademark owner
Churerstraße 120
8808 Pfäffikon
CH
8808 Pfäffikon
CH
Trademark representatives
Widenmayerstr. 23
80538 München
DE
goods and services
07
Machines for the manufacture of products for information
technology, in particular in the fields of semiconductors,
data stores, flat panel displays and optical components;
vacuum pumps (machines), namely for the semiconductor
industry; machines for semiconductor production, machines
for chip production and chip assembly; thin film production
machines; machines for carrying out coating and etching
processes, namely in semiconductor production; machines for
the assembly of semiconductor devices; machines for the
manufacture of electrical connections in semiconductor
devices, machines for coating, in particular for optical and
magnetic data carriers; machines for the manufacture of
electrical connections between chips and carrier substrate,
as well as for flip-chip assembly; all the aforesaid goods,
where contained in this class
09
Apparatus for the automatic control and monitoring of
production lines, measuring, analysis and control apparatus
for the semiconductor industry; computer software; hybrid
circuits, circuit boards with or without mounting;
semiconductor components, including transistors, rectifiers,
integrated circuits and other electronic components, in
particular those manufactured from polycrystalline silicon
and silicon starting materials; electronic components;
wafers (silicon slices for integrated circuits); glass
wafers (glass slices for integrated circuits); ingots (block
of semiconductor material); semiconductors; integrated
circuits
42
Scientific and industrial research; providing of expert
opinions, technical consultancy and providing of chemistry,
engineering, and/or physics services; design and development
of computer hardware and software
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| August 18, 2018 | 2018/33 Gaz | Deletion | |
| July 2, 2013 | 2013/27 Gaz | US | Rejection |
| April 1, 2010 | 2010/19 Gaz | Deletion | |
| January 14, 2010 | 2010/7 Gaz | CH | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| July 13, 2009 | 2009/36 Gaz | CH | Rejection |
| April 6, 2009 | 2009/21 Gaz | CN | Rejection |
| July 21, 2008 | 2008/30 Gaz | US | Rejection |
| February 6, 2008 | 2008/26 Gaz | DE | Registration |
ID: 14965985