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The International trademark was filed as Figurative mark on 08/29/2022 at the World Intellectual Property Organization.

Logodesign (Wiener Klassifikation)

#Flags #Different geometrical figures, juxtaposed, joined or intersecting #One flag #Stylized flags #Other combinations of different geometrical figures, juxtaposed, joined or intersecting, combinations of more than two different geometrical figures

Trademark Details Last update: August 11, 2023

Trademark form Figurative mark
File reference 1708010
Countries Brazil Canada European Community United Kingdom Indonesia India Japan South Korea Mexico Malaysia Singapore Thailand Turkey Vietnam
Base trademark US No. 97534812, August 4, 2022
Application date August 29, 2022
Expiration date August 29, 2032

Trademark owner

245 Freight Street
Waterbury CT 06702
US

Trademark representatives

195 Church Street, P.O. Box 1950 US

goods and services

01 Hydraulic fluids; pressure compensating fluids; motion compensating fluids; hydraulic fluids for subsea production control systems; well control fluids; subsea blowout preventer control fluids; surface blowout preventer control fluids; chemicals used in the oil and gas, exploration and production industry; industrial chemicals for use in plating, cleaning and etching metal and plastic surfaces; chemicals for use in the manufacture of commercial and industrial printing plates, namely, polymer compositions; chemicals for use in electroless plating and electroplating processes; chemical compositions for metal plating; pre-treatment preparations for plating; trivalent chromate finishing and coating preparations for plating; metal chlorides; chemicals for use in semiconductor manufacture, semiconductor device fabrication and semiconductor packaging; electroplating chemicals; chemicals for wafer level semiconductor packaging processes; chemicals for panel level semiconductor packaging processes; chemicals for fan out wafer level semiconductor packaging processes; chemicals for fan out panel level semiconductor packaging processes; chemicals for use in the circuit board industry, namely, peroxide and sulfuric acid based etchants and oxidants for roughening or etching copper surfaces prior to multilayer lamination of printed wiring boards; chemicals used in industry; adhesives for use in electronics industry; non-conductive adhesives for use in electronics industry; unprocessed epoxy resins for use in electronics industry; industrial adhesives used in the assembly, maintenance and repair of electronics for use in electronics industry; fillers for use with electronic components, namely, unprocessed epoxy resins for use as underfill; unprocessed epoxy resins; chemicals, namely, soldering flux; industrial chemicals used for cleaning circuit boards and surface mount devices; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, unprocessed epoxy resins for bonding, wetproofing, coating, encapsulation, sealing, molding, waterproofing, moisture proofing, heatproofing, solder joint attachment applications in the electronics industry; chemicals used in the cleaning, etching and plating of metals and non-metal substrates; chemicals used in the production of printed circuit boards and semiconductor materials; industrial chemicals; chemical preparations for scientific use (other than for medical or veterinary use); chemicals for laboratory analyses (other than for medical or veterinary use); chemical reagents (other than for medical or veterinary use); compositions for chemically modifying metal and nonmetal products; chemical used in activating, acidification, coating, drying, retouching and altering metal and nonmetal products; chemicals used for separating chromium compounds from aqueous solutions
03 Cleaning agents
04 Lubricants
06 Metal wire; silver solder; gold solder; brazing alloy; hard solder; metal rod for brazing and welding (including steel titanium alloy); soft solder; solder preforms; welding metal rod; tin wire
07 Machine for use in fabricating printing photopolymer plates, namely for ultraviolet exposure and imaging equipment, infrared imaging equipment, solvent and thermal developing equipment, detackification equipment, and post exposure processing equipment

Trademark history

Date Document number Area Entry
August 9, 2023 2023/32 Gaz ID Rejection
June 8, 2023 2023/23 Gaz EM Rejection
April 24, 2023 2023/17 Gaz GB Rejection
February 2, 2023 2023/6 Gaz US Correction
August 29, 2022 2023/1 Gaz US Registration

ID: 141708010