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The International trademark DSF was filed as Word mark on 09/07/2022 at the World Intellectual Property Organization.
| Trademark form | Word mark |
| File reference | 1687653 |
| Countries | 
|
| Base trademark |
No. 97417367,
May 18, 2022
|
| Application date | September 7, 2022 |
| Expiration date | September 7, 2032 |
Trademark owner
3050 Bowers Avenue
Santa Clara CA 95054
US
Santa Clara CA 95054
US
Trademark representatives
1040 Broad Street - Suite 103
Shrewsbury NJ 07702
US
goods and services
17
Densified, seam-free dielectric gapfill film used in
semiconductor manufacturing
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| July 13, 2023 | 2023/28 Gaz | JP | Rejection |
| March 15, 2023 | 2023/11 Gaz | CN | Rejection |
| February 23, 2023 | 2023/8 Gaz | EM | Rejection |
| September 7, 2022 | 2022/38 Gaz | US | Registration |
ID: 141687653