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The International trademark WELCO was filed as Word mark on 10/13/2021 at the World Intellectual Property Organization.
| Trademark form | Word mark |
| File reference | 1664432 |
| Countries | 
|
| Base trademark |
No. 018457087,
April 20, 2021
|
| Application date | October 13, 2021 |
| Expiration date | October 13, 2031 |
Trademark owner
Heraeusstr. 12-14
63450 Hanau
DE
63450 Hanau
DE
Trademark representatives
Ruhr-IP Patentanwälte Brucker Holt 58
45133 Essen
DE
goods and services
01
Agents for use in soldering in microelectronic industry;
chemical agents in paste form for use in soldering in
microelectronic industry
06
Lead-free solders for the microelectronic industry, in
particular microelectronic chip industry, in particular tin
comprising solders; solder pastes and printing-pastes of
lead-free alloys for wave soldering, THT-soldering,
through-hole technology-soldering, and SMD-soldering,
surface mounted technology soldering comprising solder metal
and its alloys with added flux for printing of
electroconductive connections of electronic components, in
particular in chip-industry, semiconductor-industry,
consumer electronic-industry and automotive-industry; solder
pastes and printing-pastes of lead-free alloys comprising
solder metal and its alloys with added flux for depositing,
in particular printing of connections of electroconductive
connections of electronic components in
semiconductor-industry to be soldered semi-automatically or
fully automatically after placement; soft solder pastes and
printing-pastes of lead-free alloys comprising solder metal
and its alloys with added flux for depositing, in particular
printing of electroconductive connections of electronic
components in semiconductor-industry to be soldered
semi-automatically or fully automatically after placement,
comprising solder metal and its alloys in form of a powder
having a particle size of less than 100 micrometer of tin,
copper, zinc and/or silver or an alloy of at least two of
the metals; solder pastes and printing-pastes of lead-free
alloys comprising solder metal and its alloys with added
flux for printing of electroconductive connections of
electronic components in industry, such as microelectronic
contacts and/or microelectronic conducting paths, in
particular in stencil printing, screen printing, mask
printing processes, in particular each followed by a heating
up to less than 300 degrees-Celsius, in particular the
solder metal and its alloys comprising tin, copper, zinc
and/or silver or an alloy of at least two of the metals;
solder pastes and printing-pastes of lead-free alloys
comprising solder metal and its alloys with added flux for
printing of electroconductive connections of electronic
components in industry, in particular in microelectronic
industry, preferred in microelectronic semiconductor chip
industry, consumer electronic industry,
semiconductor-industry, and/or automotive industry, in
particular the solder metal and their alloys comprising tin,
copper, zinc and/or silver or an alloy of at least two of
the metals, particularly iron and lead-free solder and
printing paste; common metals, precious metals, wherein the
precious metals are selected from gold, silver, rhodium,
ruthenium, palladium, osmium, iridium, and platinum and
their alloys in powder form, free from iron and free from
lead, wherein the particles of the powder having a particle
size of less than 50 micrometer for use in depositing
pastes, printing pastes and printing inks for the production
of electronic conducting paths and/or electronic conducing
contacts in microelectronic industry, in particular for use
in chip-production with pitches or line space below 300
micrometer; all goods preferred for use in chip-production
with pitches or line space from 100 nanometer up to 200
micrometer; all goods preferred for use in processes for the
production in microchip industry for surface mountable
devices (SMD), surface mountable technology (SMT),
through-hole technology (THT), pin-in-hole technology (PIH),
System in Package (SIP), System on-chip (SoC), monolithic
integration in a semiconductor (IC), in particular
comprising as metals tin, copper, zinc and/or silver or an
alloy of at least of two of the metals; solder pastes and
printing-pastes of lead-free alloys comprising common
metals, precious metal solder, wherein the precious metals
are selected from gold, silver, rhodium, ruthenium,
palladium, osmium, iridium, and platinum and alloys in
powder form with added flux, wherein the metals and alloys
are free from iron and free from lead, wherein the particles
of the powder having a particle size of less than 50
micrometer, in particular pastes and printing-pastes
according to Industry Specifications, such as IPC, preferred
IPC J-STD-005A:2012-02-14 classes T5 to T8 and/or IPC
J-STD-001; solder pastes and printing-pastes of lead-free
alloys predominantly comprising soft solder in the form of
spherical particles in a dispersing media with added flux,
in particular organic flux of mixture of solvents and resins
and optional activated chemicals to provide solder pastes
and printing-pastes of lead-free alloys viscosity for
depositing, in particular by printing, wherein the spherical
particles have an aspect ratio of the diameters of nearly 1;
solder pastes and printing-pastes of lead-free alloys
comprising soft solder in the form of spherical particles
with added flux, wherein the particles are obtained in a
dispersion process in which liquid metal or liquid alloy is
dispersed in a dispersing media, wherein the flux comprises
organic flux to provide solder pastes and printing-pastes of
lead-free alloys a viscosity for depositing; preferred all
goods for depositing, in particular by printing, underfill
technologies for flip-chip (FC), and
fine-pitch-ball-grid-array (FPBGA), including chip-size
packaging (CSP), preferred according to Industry
Specifications (IPC); soft solder for microelectronic
application in the form of a printable paste for use in
microelectronic application, wherein the paste comprises
powder having a particle size of less than 50 micrometers of
tin, copper, zinc and silver; in particular all of the above
mentioned goods comprising tin; in particular all the
above-mentioned goods not for soldering of water pipes,
copper pipes, gutters, jewelry and/or iron-containing
components, in particular in the field of gas and water
pipes
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| June 24, 2023 | 2023/26 Gaz | KR | Rejection |
| April 27, 2023 | 2023/17 Gaz | JP | Rejection |
| February 13, 2023 | 2023/11 Gaz | SG | Rejection |
| December 7, 2022 | 2022/49 Gaz | CN | Rejection |
| November 2, 2022 | 2022/44 Gaz | GB | Rejection |
| October 13, 2021 | 2022/20 Gaz | EM | Registration |
ID: 141664432