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The International trademark R.F.C.P. was filed as Word mark on 11/01/2021 at the World Intellectual Property Organization.
| Trademark form | Word mark |
| File reference | 1637145 |
| Countries | 
|
| Base trademark |
No. 2021-115404,
September 16, 2021
|
| Application date | November 1, 2021 |
| Expiration date | November 1, 2031 |
Trademark owner
5, Kamitoba Kamichoshi-cho,
Minami-ku, Kyoto-shi
JP
Minami-ku, Kyoto-shi
JP
Trademark representatives
East Chiyoda Building 6F,
2-9-4 Higashi Tenma,
JP
goods and services
07
Molds for sealing resins for manufacturing semiconductors;
molds for manufacturing semiconductors; resin sealing
machines for manufacturing semiconductors and parts and
fittings thereof; semiconductor manufacturing machines and
parts and fittings thereof; semiconductor processing
machines and apparatus and parts and fittings thereof; molds
for sealing resins of integrated circuits; molds for sealing
resins of electronic circuits; molds for sealing resins of
circuit boards; molds for sealing resins of electronic
parts; resin sealing machines for integrated circuits and
parts and fittings thereof; resin sealing machines for
electronic circuits and parts and fittings thereof; resin
sealing machines for circuit boards and parts and fittings
thereof; resin sealing machines for electronic parts and
parts and fittings thereof; integrated circuits
manufacturing machines and parts and fittings thereof;
electronic circuits manufacturing machines and parts and
fittings thereof; circuit boards manufacturing machines and
parts and fittings thereof; electronic parts manufacturing
machines and parts and fittings thereof; molds for
processing resins; molds for processing plastics; plastic
processing machines and apparatus and parts and fittings
thereof
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| January 19, 2023 | 2023/3 Gaz | KR | Rejection |
| September 3, 2022 | 2022/36 Gaz | US | Rejection |
| July 7, 2022 | 2022/27 Gaz | CN | Rejection |
| November 1, 2021 | 2021/51 Gaz | JP | Registration |
ID: 141637145