ELAN-Bond

WIPO WIPO 2021

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The International trademark ELAN-Bond was filed as Word mark on 07/09/2021 at the World Intellectual Property Organization.

Trademark Details Last update: June 20, 2023

Trademark form Word mark
File reference 1620077
Countries China Indonesia Japan South Korea Philippines Singapore Thailand Vietnam
Base trademark MY No. TM2021001009, January 12, 2021
Application date July 9, 2021
Expiration date July 9, 2031

Trademark owner

LOT NO. 550, Jalan Keretapi Lama,
Batu 7 ½, Jalan Kapar/ku 15
MY

Trademark representatives

c/o SPRUSON & FERGUSON (M) SDN BHD, A-33A-07 (Level 33A), MY

goods and services

17 Resins in liquid form (semi-finished products); synthetic, conductive and thermosetting resins (semi-finished products); insulation material made of natural rubber, gutta-percha, rubber or mica; sealing and insulating material; liquid electrical insulation materials; adhesives for electrical insulation purposes; insulating fillers; seals, sealants and fillers

Trademark history

Date Document number Area Entry
June 1, 2023 2023/23 Gaz KR RAW: Rule 18ter(2)(ii) GP following a provisional refusal
April 7, 2023 2023/15 Gaz TH Rejection
November 24, 2022 2022/48 Gaz JP RAW: Rule 18ter(2)(ii) GP following a provisional refusal
October 19, 2022 2022/42 Gaz VN Rejection
October 4, 2022 2022/40 Gaz KR Rejection
September 21, 2022 2022/38 Gaz ID Rejection
July 28, 2022 2022/30 Gaz JP Rejection
May 20, 2022 2022/27 Gaz SG RAW: Rule 18ter(2)(ii) GP following a provisional refusal
May 18, 2022 2022/30 Gaz PH RAW: Rule 18ter(2)(i) GP following a provisional refusal
February 15, 2022 2022/7 Gaz CN Rejection
January 13, 2022 2022/3 Gaz SG Rejection
November 7, 2021 2021/46 Gaz PH Rejection
July 9, 2021 2021/40 Gaz MY Registration

ID: 141620077