FORGE DEVCON

WIPO WIPO 2020

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The International trademark FORGE DEVCON was filed as Word mark on 11/09/2020 at the World Intellectual Property Organization.

Trademark Details Last update: July 29, 2022

Trademark form Word mark
File reference 1564797
Countries China em United Kingdom Japan
Base trademark US No. 88920874, May 18, 2020
Application date November 9, 2020
Expiration date November 9, 2030

Trademark owner

The Landmark @ One Market
1 Market Street, Suite 400
US

Trademark representatives

1300 19th Street, NW, Suite 300 US

goods and services

41 Educational services, namely, seminars, conferences, classes, and workshops for software developers in the fields of 3D design, engineering, and construction

Trademark history

Date Document number Area Entry
November 18, 2021 2021/46 Gaz JP Rejection
April 28, 2021 2021/17 Gaz GB Rejection
April 28, 2021 2021/17 Gaz EM Rejection
April 16, 2021 2021/16 Gaz CN Rejection
November 9, 2020 2020/48 Gaz US Registration

ID: 141564797