09
Integrated circuit chips; microwave generating devices for
industrial use, namely, microwave integrated circuits;
transistors; diodes; semiconductor devices; semiconductor
chips; semiconductor wafers, namely, silicon carbide
semiconductor wafers, radio frequency (RF) devices, namely,
packaged monolithic microwave integrated circuits (MMIC),
packaged discrete transistors, semiconductor devices in the
nature of MMIC bare die, discrete broadband die, and
discrete bare die; power transistor switching devices;
electric switches, electric controllers; electric circuitry,
namely, electric circuits, electric circuit closers,
electric circuit openers, and power modules
40
Customized materials assembly for others; manufacture of
radio frequency in microwave devices and components,
monolithic microwave integrated circuits (MMIC) bare die;
discrete broadband die, discrete bare die for others;
manufacture of transistors for others; manufacture of
wireless communication components; manufacture of amplifiers
for others; manufacture of components formatted for the
worldwide interoperability for microwave access standard for
others; manufacturing services for others in the field of
semiconductor devices; providing semiconductor material
treatment information; technical support services, namely,
providing technical advice related to the manufacture of
semiconductor materials and devices
42
Testing of semiconductor materials and devices, namely,
silicon carbide and/or gallium nitride power and wireless
systems; technical project research of semiconductor
materials and devices, namely, silicon carbide and/or
gallium nitride power and wireless systems; research and
development of semiconductor materials and devices, namely,
silicon carbide and/or gallium nitride power and wireless
systems for others; engineering service in the field of
semiconductor materials and devices, namely, silicon carbide
and/or gallium nitride power and wireless systems; design of
radio frequency and microwave devices and components in the
nature of packaged monolithic microwave integrated circuits
(MMIC), packaged discrete transistors, MMIC bare die,
discrete broadband die, discrete bare die for others,
transistors, wireless communication components, amplifiers,
lateral diffused metal oxide semiconductors (LDMOS), metal
semiconductor field effect transistors (MESFETS), and
components formatted for the worldwide interoperability for
microwave access standard; packaging design; contract
foundry design, testing and engineering support services in
the field of semiconductor materials and devices