SOLDER REDEFINED Logo (WIPO, 10/25/2019)
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The International trademark SOLDER REDEFINED was filed as Word mark on 10/25/2019 at the World Intellectual Property Organization.
| Trademark form | Word mark |
| File reference | 1508705 |
| Countries | 
|
| Base trademark |
No. 88429449,
May 14, 2019
|
| Application date | October 25, 2019 |
| Expiration date | October 25, 2029 |
Trademark owner
34 Robinson Road
Clinton NY 13323
US
Clinton NY 13323
US
Trademark representatives
333 West Washington Street
Suite 200
US
goods and services
35
Provision of technical information and advice to consumers
regarding the selection of products to be purchased, said
products being nano-materials, specialty alloys, solder
paste, solder preforms, solder spheres, solder wire, solder
tubing, solder ribbon, solder foil, solder fluxes,
electrically conductive adhesives, electrically conductive
underfills, electrically conductive polymers, indium
containing fabrications and pure indium
40
Provision of technical information and advice to consumers
regarding manufacturing processing parameters for
nano-materials, specialty alloys, solder paste, solder
preforms, solder spheres, solder wire, solder tubing, solder
ribbon, solder foil, solder fluxes, electrically conductive
adhesives, electrically conductive underfills, electrically
conductive polymers, indium containing fabrications and pure
indium
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| March 28, 2022 | 2022/16 Gaz | IN | Rejection |
| June 22, 2020 | 2020/26 Gaz | EM | Rejection |
| May 13, 2020 | 2020/22 Gaz | CN | Rejection |
| April 21, 2020 | 2020/17 Gaz | SG | Rejection |
| January 20, 2020 | 2020/5 Gaz | IN | Rejection |
| October 25, 2019 | 2019/52 Gaz | US | Registration |
ID: 141508705