JPP Logo (WIPO, 06/19/2019)
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The International trademark JPP was filed as Word mark on 06/19/2019 at the World Intellectual Property Organization.
| Trademark form | Word mark |
| File reference | 1491828 |
| Register number | 6143225 |
| Countries | 
|
| Base trademark |
No. 6143225,
May 10, 2019
|
| Application date | June 19, 2019 |
| Expiration date | June 19, 2029 |
Trademark owner
23 Senju-hashido-cho,
Adachi-ku
JP
Adachi-ku
JP
Trademark representatives
C/O OHNO & PARTNERS,
Marunouchi Kitaguchi Bldg. 21F,
JP
goods and services
01
Chemicals; soldering pastes; soldering chemicals; soldering
fluxes
06
Nonferrous metals and their alloys; copper and copper
alloys; lead and lead alloys; tin and tin alloys; solders;
solder alloys; silver solder; gold solder; lead-free solder;
solder in the form of ball; solder in the form of rod;
solder in the form of line; solder with grease; solder in
the form of paste; solder in the form of powder
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| March 2, 2021 | 2021/9 Gaz | KR | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| August 18, 2020 | 2020/34 Gaz | KR | Rejection |
| December 18, 2019 | 2019/51 Gaz | CN | Rejection |
| June 19, 2019 | 2019/39 Gaz | JP | Registration |
ID: 141491828