MR.BOND Logo (WIPO, 08/26/2019)
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The International trademark MR.BOND was filed as Figurative mark on 08/26/2019 at the World Intellectual Property Organization.
#Letters presenting a special form of writing #Inscriptions in chinese, japanese or korean characters #Letters underlined, overlined, framed or barred by one or more strokes #28.03.00
Trademark form | Figurative mark |
File reference | 1491591 |
Register number | 14654748 |
Countries | |
Base trademark | No. 14654748, August 14, 2015 |
Application date | August 26, 2019 |
Expiration date | August 26, 2029 |
Date | Document number | Area | Entry |
---|---|---|---|
December 14, 2021 | 2021/51 Gaz | KR | Rejection |
December 1, 2021 | 2021/49 Gaz | KH | RAW: Rule 18ter(2)(i) GP following a provisional refusal |
August 4, 2021 | 2021/32 Gaz | SG | RAW: Refusal Transfer of Ownership |
March 17, 2021 | 2021/11 Gaz | LA | Rejection |
February 24, 2021 | 2021/9 Gaz | TH | Rejection |
December 28, 2020 | 2021/1 Gaz | KH | Rejection |
December 21, 2020 | 2021/1 Gaz | ID | Rejection |
November 12, 2020 | 2020/47 Gaz | JP | Rejection |
October 23, 2020 | 2020/44 Gaz | KR | Rejection |
October 7, 2020 | 2020/41 Gaz | VN | Rejection |
September 15, 2020 | 2020/38 Gaz | IN | Rejection |
August 22, 2020 | 2020/36 Gaz | SG | Rejection |
April 7, 2020 | 2020/15 Gaz | SG | Rejection |
January 30, 2020 | 2020/5 Gaz | PH | Rejection |
August 26, 2019 | 2019/39 Gaz | CN | Registration |
ID: 141491591