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The International trademark SEN was filed as Word mark on 07/19/2017 at the World Intellectual Property Organization.
| Trademark form | Word mark |
| File reference | 1372922 |
| Register number | 5884936 |
| Countries | 
|
| Base trademark |
No. 5884936,
September 30, 2016
|
| Application date | July 19, 2017 |
| Expiration date | July 19, 2027 |
Trademark owner
23 Senju-hashido-cho,
Adachi-ku
JP
Adachi-ku
JP
Trademark representatives
c/o OHNO & PARTNERS,
Marunouchi Kitaguchi Bldg. 21F,
JP
goods and services
06
Nonferrous metals and their alloys; copper and its alloys;
lead and its alloys; tin and its alloys; solders; solder
alloys; silver solder; gold solder; lead-free solder; solder
in the form of balls; solder in the form of rods; solder in
the form of line; solder with grease; metal wires for
soldering; solder in the form of paste; solder in the form
of powder
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| March 17, 2022 | 2022/12 Gaz | VN | Rejection |
| October 1, 2019 | 2020/18 Gaz | MX | Rejection |
| January 31, 2019 | 2019/6 Gaz | US | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| November 15, 2018 | 2018/47 Gaz | MX | Rejection |
| November 1, 2018 | 2018/45 Gaz | VN | Rejection |
| October 12, 2018 | 2018/42 Gaz | KR | Rejection |
| August 1, 2018 | 2018/33 Gaz | CN | Rejection |
| April 4, 2018 | 2018/14 Gaz | EM | Rejection |
| February 6, 2018 | 2018/6 Gaz | PH | Rejection |
| December 14, 2017 | 2018/1 Gaz | US | Rejection |
| July 19, 2017 | 2017/42 Gaz | JP | Registration |
ID: 141372922