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The International trademark PIPE BOND was filed as Word mark on 04/12/2017 at the World Intellectual Property Organization.
| Trademark form | Word mark |
| File reference | 1361720 |
| Countries | 
|
| Base trademark |
No. 2017-018329,
February 16, 2017
|
| Application date | April 12, 2017 |
| Expiration date | July 20, 2018 |
Trademark owner
23 Senju-hashido-cho,
Adachi-ku
JP
Adachi-ku
JP
Trademark representatives
C/O OHNO & PARTNERS,
Marunouchi Kitaguchi Bldg. 21F,
JP
goods and services
06
Nonferrous metals and the alloys; copper and copper alloys,
tin and tin alloys; lead and lead alloys; solders; solder
paste; solder wire; resin core wire of nonferrous metals;
solder preform; solder ball; ingot solder; lead-free solder;
solder alloys; silver solder; solder (silver-); solder
(gold-); soldering wire of metal
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| July 8, 2019 | 2019/32 Gaz | JP | RAW: Total Ceasing Effect |
| April 9, 2019 | 2019/15 Gaz | US | Rejection |
| November 23, 2018 | 2018/48 Gaz | CN | Rejection |
| August 28, 2018 | 2018/36 Gaz | KR | Rejection |
| May 11, 2018 | 2018/28 Gaz | EM | Rejection |
| March 16, 2018 | 2018/12 Gaz | KR | Rejection |
| September 12, 2017 | 2017/39 Gaz | EM | Rejection |
| September 11, 2017 | 2017/37 Gaz | US | Rejection |
| April 12, 2017 | 2017/32 Gaz | JP | Registration |
ID: 141361720