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The International trademark AVOID THE VOID was filed as Word mark on 04/19/2016 at the World Intellectual Property Organization.
| Trademark form | Word mark |
| File reference | 1334314 |
| Countries | 
|
| Base trademark |
No. 86819727,
November 13, 2015
|
| Application date | April 19, 2016 |
| Expiration date | April 19, 2026 |
Trademark owner
34 Robinson Road
Clinton NY 13323
US
Clinton NY 13323
US
Trademark representatives
333 West Washington Street,
Suite 200
US
goods and services
01
Nano-materials, solder fluxes, electrically-conductive
adhesives, electrically-conductive underfills,
electrically-conductive polymers
06
Specialty alloys, solder paste, solder preforms, solder
spheres, solder wire, solder tubing, solder ribbon, solder
foil, indium-containing fabrications, and pure indium
41
Educational services, namely, providing publication of
on-line journals blogs on the internet and online
non-downloadable publications in the nature of articles,
brochures, and technical papers in the fields of solders,
specialty alloys, and electrically-conductive materials;
educational services, namely, live and on-line classes,
seminars, conferences, meetings, workshops and informal
programs using on-line activities and interactive exhibits
and printable materials distributed therewith in the field
of developing, manufacturing, supplying, and processing
nano-materials, specialty alloys, solder paste, solder
preforms, solder spheres, solder wire, solder tubing, solder
ribbon, solder foil, solder fluxes, electrically-conductive
adhesives, electrically-conductive underfills,
electrically-conductive polymers, indium-containing
fabrications, and pure indium
42
Technical consultation in the field of developing,
manufacturing and supplying nano-materials, specialty
alloys, solder paste, solder preforms, solder spheres,
solder wire, solder tubing, solder ribbon, solder foil,
solder fluxes, electrically-conductive adhesives,
electrically-conductive underfills, electrically-conductive
polymers, indium-containing fabrications, and pure indium;
technical consultation in the process techniques and uses of
developing nano-materials, specialty alloys, solder paste,
solder preforms, solder spheres, solder wire, solder tubing,
solder ribbon, solder foil, solder fluxes,
electrically-conductive adhesives, electrically-conductive
underfills, electrically-conductive polymers,
indium-containing fabrications, and pure indium
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| July 3, 2018 | 2018/29 Gaz | CN | Rejection |
| May 1, 2018 | 2018/23 Gaz | IN | RAW: Rule 18ter(2)(i) GP following a provisional refusal |
| April 18, 2018 | 2018/28 Gaz | SG | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| March 20, 2018 | 2018/21 Gaz | VN | Rejection |
| March 7, 2018 | 2018/10 Gaz | MX | Rejection |
| March 2, 2018 | 2018/16 Gaz | VN | Rejection |
| March 1, 2018 | 2018/10 Gaz | VN | Rejection |
| November 22, 2017 | 2017/48 Gaz | JP | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| August 11, 2017 | 2017/33 Gaz | EM | Rejection |
| June 22, 2017 | 2017/26 Gaz | JP | Rejection |
| June 12, 2017 | 2017/30 Gaz | IN | Rejection |
| May 24, 2017 | 2017/35 Gaz | US | RAW: Partial Ceasing Effect |
| May 23, 2017 | 2017/24 Gaz | SG | Rejection |
| April 19, 2016 | 2017/8 Gaz | US | Registration |
ID: 141334314