HEAT SHIELD Via Pad

WIPO WIPO 2013

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The International trademark HEAT SHIELD Via Pad was filed as Figurative mark on 05/29/2013 at the World Intellectual Property Organization.

Logodesign (Wiener Klassifikation)

#Shields #Letters presenting a special form of writing #Shields containing inscriptions #Letters linked to a figurative element #Series of letters presenting different forms of writing #Series of letters in different dimensions

Trademark Details Last update: March 16, 2022

Trademark form Figurative mark
File reference 1169196
Register number 302012007799.4/17
Countries em Japan South Korea Singapore United States of America (USA) Switzerland China
Base trademark DE No. 30 2012 007 799.4/17, December 11, 2012
Application date May 29, 2013
Expiration date May 29, 2023

Trademark owner

Am Boden 27
35460 Staufenberg
DE

Trademark representatives

Sonnenstrasse 33 80331 München DE

goods and services

17 Refractory insulating material, especially press pads made of cellulose fibres, Nomex and ceramics for compressing (laminating) of adhesives, prepregs (preimpregnated fibres) and foils in the field of the printed circuit board and insulating material industry

Trademark history

Date Document number Area Entry
February 25, 2022 2022/11 Gaz US RAW: Total Invalidation
April 15, 2019 2019/18 Gaz CN RAW: Rule 18ter(4) all goods and services protected
June 24, 2015 2015/29 Gaz SG RAW: Rule 18ter(2)(ii) GP following a provisional refusal
September 11, 2014 2014/37 Gaz JP RAW: Rule 18ter(2)(ii) GP following a provisional refusal
July 17, 2014 2014/31 Gaz CN Rejection
July 9, 2014 2014/28 Gaz US RAW: Rule 18ter(2)(ii) GP following a provisional refusal
July 4, 2014 2014/30 Gaz CH Rejection
June 12, 2014 2014/24 Gaz KR Rejection
June 4, 2014 2014/23 Gaz EM Rejection
March 13, 2014 2014/11 Gaz JP Rejection
January 7, 2014 2014/4 Gaz SG Rejection
September 23, 2013 2013/39 Gaz US Rejection
May 29, 2013 2013/29 Gaz DE Registration

ID: 141169196