HEAT SHIELD Via Pad Logo (WIPO, 05/29/2013)
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The International trademark HEAT SHIELD Via Pad was filed as Figurative mark on 05/29/2013 at the World Intellectual Property Organization.
#Shields #Letters presenting a special form of writing #Shields containing inscriptions #Letters linked to a figurative element #Series of letters presenting different forms of writing #Series of letters in different dimensions
Trademark form | Figurative mark |
File reference | 1169196 |
Register number | 302012007799.4/17 |
Countries | |
Base trademark | No. 30 2012 007 799.4/17, December 11, 2012 |
Application date | May 29, 2013 |
Expiration date | May 29, 2023 |
Date | Document number | Area | Entry |
---|---|---|---|
February 25, 2022 | 2022/11 Gaz | US | RAW: Total Invalidation |
April 15, 2019 | 2019/18 Gaz | CN | RAW: Rule 18ter(4) all goods and services protected |
June 24, 2015 | 2015/29 Gaz | SG | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
September 11, 2014 | 2014/37 Gaz | JP | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
July 17, 2014 | 2014/31 Gaz | CN | Rejection |
July 9, 2014 | 2014/28 Gaz | US | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
July 4, 2014 | 2014/30 Gaz | CH | Rejection |
June 12, 2014 | 2014/24 Gaz | KR | Rejection |
June 4, 2014 | 2014/23 Gaz | EM | Rejection |
March 13, 2014 | 2014/11 Gaz | JP | Rejection |
January 7, 2014 | 2014/4 Gaz | SG | Rejection |
September 23, 2013 | 2013/39 Gaz | US | Rejection |
May 29, 2013 | 2013/29 Gaz | DE | Registration |
ID: 141169196