C P C

WIPO WIPO 2012

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The International trademark C P C was filed as Figurative mark on 10/05/2012 at the World Intellectual Property Organization.

Trademark Details Last update: May 29, 2023

Trademark form Figurative mark
File reference 1139263
Register number 5523781
Countries em South Korea United States of America (USA)
Base trademark JP No. 5523781, September 21, 2012
Application date October 5, 2012
Expiration date October 5, 2032

Trademark owner

8-21-1, Ginza, Chuo-ku
Tokyo 104-0061
JP

Trademark representatives

Nakanoshima Festival Tower West, 2-4, Nakanoshima 3-chome, JP

goods and services

06 Composite materials composed of copper and molybdenum; nonferrous metals and their alloys
09 Heat radiation components for semiconductor devices made of composite materials composed of copper and molybdenum; heat spreaders for semiconductor devices made of composite materials composed of copper and molybdenum; heat radiation components for semiconductor devices; heat spreaders for semiconductor devices

Trademark history

Date Document number Area Entry
October 5, 2022 2022/40 Gaz Extension
May 13, 2020 2020/23 Gaz US RAW: Partial Invalidation
June 28, 2016 2016/47 Gaz EM RAW: Rule 18ter(2)(ii) GP following a provisional refusal
June 13, 2014 2014/25 Gaz US RAW: Rule 18ter(2)(ii) GP following a provisional refusal
March 13, 2014 2014/12 Gaz EM Rejection
February 6, 2014 2014/6 Gaz KR Rejection
November 12, 2013 2013/50 Gaz CN Rejection
June 21, 2013 2013/26 Gaz US Rejection
March 8, 2013 2013/16 Gaz JP Correction
October 5, 2012 2012/48 Gaz JP Registration
Partial deletion

ID: 141139263