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The International trademark SolderFill was filed as Word mark on 05/19/2009 at the World Intellectual Property Organization.
| Trademark form | Word mark |
| File reference | 1009250 |
| Register number | 302008078077.0/01 |
| Countries | 
|
| Base trademark |
No. 30 2008 078 077.0/01,
April 8, 2009
|
| Application date | May 19, 2009 |
| Expiration date | May 19, 2029 |
Trademark owner
Erasmusstraße 20
10553 Berlin
DE
10553 Berlin
DE
goods and services
01
Chemical preparations used in surface treatment of metals,
semiconductors and synthetic materials, particularly for
electroplating; galvanizing baths; galvanizing preparations;
chemical preparations used for the deposition of tin and tin
alloy layers (included in this class)
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| May 19, 2019 | 2019/21 Gaz | Extension | |
| January 12, 2019 | 2019/3 Gaz | US | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| February 6, 2018 | 2018/17 Gaz | IT | Rejection |
| November 30, 2017 | 2017/48 Gaz | SG | Rejection |
| August 17, 2017 | 2017/36 Gaz | AT | Rejection |
| May 15, 2017 | 2017/20 Gaz | US | Rejection |
| December 16, 2016 | 2017/14 Gaz | Correction | |
| October 8, 2010 | 2010/41 Gaz | KR | Rejection |
| March 4, 2010 | 2010/9 Gaz | JP | Rejection |
| May 19, 2009 | 2009/34 Gaz | DE | Registration |
ID: 141009250