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The International trademark ALCSP was filed as Figurative mark on 12/22/2008 at the World Intellectual Property Organization.
| Trademark form | Figurative mark |
| File reference | 1006059 |
| Countries | 
|
| Base trademark |
No. 2008-78749,
September 26, 2008
|
| Application date | December 22, 2008 |
| Expiration date | December 22, 2028 |
Trademark owner
1-2-70, Konan,
Minato-ku
JP
Minato-ku
JP
Trademark representatives
Eikoh Patent Firm,
7-13, Nishi-Shimbashi 1-chome,
JP
goods and services
09
Semiconductor device; semiconductor chips; integrated
circuits; integrated circuit chips; integrated circuit
module; integrated circuit package; IC (integrated circuit);
IC chips; IC module; IC package; semiconductor memory;
dynamic random access memory; semiconductor memory module;
dynamic random access memory module; wafer level package;
semiconductor element; electronic circuits; large scale
integrated circuits; integrated circuit wafer; semiconductor
wafer; IC (integrated circuit) memories; floppy disks,
disks, CD-ROM, memory chips, tapes and other recording media
recorded with computer programs for database relating to
processing facility, processing equipment and processing
technology of semiconductor chips; magnetic drum, magnetic
disks, magnetic tapes, CD-ROM, electronic circuits and other
recording media recorded with computer programs for
development and designing of semiconductor element,
integrated circuits and electronic circuits; recording media
recorded with application software for designing of
processing technology, processing device and electric
circuit modeling of integrated circuits; computer software
for designing and establishing database of processing
facility of semiconductor chips; computer software for
designing and establishing database of designing device and
processing technology of integrated circuits; computer
software for designing of integrated circuits; electronic
machines, apparatus and their parts
40
Assembling of semiconductor device and semiconductor device
package; manufacturing and assembling of IC package;
manufacturing and assembling of semiconductor device and
integrated circuits; manufacturing and assembling of wafer
level package; manufacturing and assembling of
semi-conductors, memory chips, wafer, wafer level package
and integrated circuits for others; manufacturing and
assembling of semi-conductors and integrated circuits for
others; manufacturing and assembling of electronic machines,
apparatus and their parts; manufacturing and assembling of
semiconductor element for others; manufacturing and
assembling of semi-conductors for others; manufacturing and
assembling of semiconductor wafer for others; manufacturing
and assembling of integrated circuits for others; assembling
or packing (packaging, implementing or mounting) in relation
to semiconductor device or integrated circuits; providing
information about processing semiconductors; providing
information about processing semiconductor element;
providing information about processing integrated circuits;
providing information about manufacturing semiconductor
wafer
42
Designing of semiconductor device package; designing of IC
package; designing of semiconductor element, semiconductor
device, integrated circuits, semiconductor memory, dynamic
random access memory, semiconductor device package, IC
package and wafer level package; testing, inspection or
research on semiconductor element, semiconductor device,
integrated circuits, semiconductor memory, dynamic random
access memory, semiconductor device package, IC package and
wafer level package; designing about integrated circuits;
designing of semi-conductors, semiconductor element and
integrated circuits; providing computer programs for
designing of processing technology, processing device and
electric circuit modeling of integrated circuits via
Internet; providing information about design and development
of semiconductor integrated circuits; providing information
about inspection on semi-conductors; providing information
about designing of semi-conductors; advisory and consultancy
services relating to designing of integrated circuits;
research, development and designing of semiconductor
element, integrated circuits and electronic circuits;
advisory, consultancy and information services relating to
research, development and designing of semiconductor
element, integrated circuits and electronic circuits
Trademark history
| Date | Document number | Area | Entry |
|---|---|---|---|
| December 22, 2018 | 2018/52 Gaz | Extension | |
| January 24, 2018 | 2018/6 Gaz | US | RAW: Total Invalidation |
| March 11, 2011 | 2013/5 Gaz | KR | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| January 10, 2011 | 2013/4 Gaz | US | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| July 29, 2010 | 2010/31 Gaz | EM | Rejection |
| June 28, 2010 | 2010/27 Gaz | KR | Rejection |
| February 3, 2010 | 2013/2 Gaz | SG | RAW: Rule 18ter(2)(ii) GP following a provisional refusal |
| August 7, 2009 | 2009/34 Gaz | US | Rejection |
| August 3, 2009 | 2009/33 Gaz | SG | Rejection |
| December 22, 2008 | 2009/28 Gaz | JP | Registration |
| Partial deletion |
ID: 141006059