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The US trademark HIGH DENSITY VIA PATTERN (HDVP) was filed as Word mark on 01/23/2020 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE".
| Trademark form | Word mark |
| File reference | 88771443 |
| Register number | 88771443 |
| Application date | January 23, 2020 |
Trademark owner
Suite 2501665 Scenic Ave.
92626 Costa Mesa
US
92626 Costa Mesa
US
Trademark representatives
100 S. Fourth Street
63102 St. Louis
US
goods and services
9
Electrical and Scientific Apparatus
40
Material Treatment
ID: 13