BONDDEX Logo (USPTO, 12/22/2018)
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The US trademark BONDDEX was filed as Word and figurative mark on 12/22/2018 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE".
Logodesign (Wiener Klassifikation)
#USPTO: 28.01.03 - Japanese characters, Japanese and Chinese characters, Chinese characters
| Trademark form | Word and figurative mark |
| File reference | 88240128 |
| Register number | 88240128 |
| Application date | December 22, 2018 |
Trademark owner
1f., No. 9, Ln. 230, Heti Rd.Sanmin Dist.
807,R.O.C Kaohsiung City
TW
807,R.O.C Kaohsiung City
TW
Trademark representatives
666 Third Avenue
10017-5621 New York
US
goods and services
19
Non-metallic Building Materials
ID: 13