ECO SOLDER SMIC SENJU METAL INDUSTRY CO., LTD.

USPTO USPTO 2017 REGISTERED

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The US trademark ECO SOLDER SMIC SENJU METAL INDUSTRY CO., LTD. was filed as Word and figurative mark on 01/31/2017 at the U.S. Patent and Trademark Office. The current status of the mark is "REGISTERED".

Logodesign (Wiener Klassifikation)

#USPTO: 01.07.02 - Globes with meridians and parallels only #USPTO: 19.07.03 - Boxes, cigarette #USPTO: 19.07.04 - Cartons, flattened, Flattened packages and cartons, Packages, flattened #Bottles or flasks, slender #USPTO: 26.17.01 - Bands, straight, Bars, straight, Lines, straight, Straight line(s), band(s) or bar(s) #USPTO: 26.17.06 - Bands, diagonal, Bars, diagonal, Diagonal line(s), band(s) or bar(s), Lines, diagonal #USPTO: 27.03.05 - Objects forming letters or numerals

Trademark Details Last update: February 14, 2024

Trademark form Word and figurative mark
File reference 5431079
Register number 87319412
Application date January 31, 2017

Trademark owner

23 Senju-hashido-choAdachi-ku
120-8555 Tokyo
392

goods and services

6 Metal goods

ID: 13