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The US trademark CORECLAD was filed as Word mark on 01/18/2011 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".
| Trademark form | Word mark |
| File reference | 85219599 |
| Application date | January 18, 2011 |
| Publication date | June 14, 2011 |
Trademark owner
3800 West 143rd Street
44111 Cleveland
US
44111 Cleveland
US
Trademark representatives
goods and services
9
Printed circuit boards; chip scale packaging, namely, semiconductor packaging for manufacturers of semiconductors and electronic components, systems and devices utilizing semiconductors comprising dies, substrates, interposers, wire bond and solder bumps, circuitized lead frames and circuit boards used to protect integrated circuits from contaminants, moisture, and mechanical damage and to provide for electrical connections to and from the integrated circuits
ID: 1385219599