MODULE-IN-CHIP

USPTO USPTO 2017 ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE

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The US trademark MODULE-IN-CHIP was filed as Word mark on 06/21/2017 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE".

Trademark Details Last update: December 4, 2021

Trademark form Word mark
File reference 79227560
Register number 79227560
Application date June 21, 2017

Trademark owner

Carl-scheele-straße 1612489 Berlin

Trademark representatives

Carl-scheele-straße 16 12489 Berlin DE

goods and services

9 Electrical and Scientific Apparatus
38 Communication
42 Scientific and computer services

ID: 13