HALOGEN FREE HF Logo (USPTO, 07/14/2016)
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The US trademark HALOGEN FREE HF was filed as Word and figurative mark on 07/14/2016 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE".
| Trademark form | Word and figurative mark |
| File reference | 79200200 |
| Application date | July 14, 2016 |
Trademark owner
Asahi-cho,; Adachi-ku; Tokyo 120-0026
Trademark representatives
goods and services
1
Chemicals which do not contain halogen compounds, for use in industry and science other than for medical or veterinary use; metal tempering preparations which do not contain halogen compounds; chemicals which do not contain halogen compounds, for cleaning printed circuit boards, namely, solvent type processing compositions for use in the electronics industry; chemicals which do not contain halogen compounds, used for anti-tarnishing, plating, soldering, etching, stripping, and deterging metal surfaces for use in the manufacture of electronic circuit boards, namely, solder mask, etchants for use in the manufacture of printed circuit boards, masking compounds for use in the manufacture of printed circuit boards, doping compounds for use in the manufacture of printed circuit boards, chemical oxidants for use in the manufacture of printed circuits, chemical coatings used in the manufacture of printed circuit boards; surface active chemical agents for use in the manufacture of detergents which do not contain halogen compounds; soldering paste which do not contain halogen compounds; soldering cream which do not contain halogen compounds; soldering fluxes which do not contain halogen compounds; chemicals for welding and soldering purposes which do not contain halogen compounds; chemical preparations for welding which do not contain halogen compounds; chemical preparations for soldering which do not contain halogen compounds; soldering chemicals which do not contain halogen compounds
6
Hard or soft solder bars which do not contain halogen compounds; solder wire which do not contain halogen compounds; hard or soft solders containing resin which do not contain halogen compounds; resin core wire which do not contain halogen compounds, namely, filamentous solder in which resin flux is filled for use in industrial welding; non-ferrous metals and their alloys which do not contain halogen compounds
ID: 1379200200