HEAT-PAK DUAL OVERLAY SYSTEM Logo (USPTO, 01/31/2007)
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The US trademark HEAT-PAK DUAL OVERLAY SYSTEM was filed as Word and figurative mark on 01/31/2007 at the U.S. Patent and Trademark Office.
It was registered as a trademark on 02/26/2008.
The current status of the mark is "SECTION 71 ACCEPTED".
| Trademark form | Word and figurative mark |
| File reference | 79036290 |
| Register number | 3389228 |
| Application date | January 31, 2007 |
| Publication date | December 11, 2007 |
| Entry date | February 26, 2008 |
Trademark owner
NL-7418 EV Deventer
Trademark representatives
goods and services
19
Floorboards, not of metal, to be used for subfloors and partition floors on floor-heating systems
ID: 1379036290