FLIPCHIP INTERNATIONAL VENTURES Logo (USPTO, 04/19/2006)
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The US trademark FLIPCHIP INTERNATIONAL VENTURES was filed as Word and figurative mark on 04/19/2006 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".
| Trademark form | Word and figurative mark |
| File reference | 78865082 |
| Application date | April 19, 2006 |
| Publication date | September 18, 2007 |
Trademark owner
3701 E. University Drive
85034 Phoenix
US
85034 Phoenix
US
Trademark representatives
goods and services
40
operation of technology of third parties, namely custom manufacture of products in the wafer bumping and wafer scale packaging semiconductor market
42
Development of new technology for third parties in the wafer bumping and wafer scale packaging semiconductor market; and technology consultation in the wafer bumping and wafer scale packaging semiconductor market
ID: 1378865082