3D HI-VOID

USPTO USPTO 2006 ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE

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The US trademark 3D HI-VOID was filed as Word mark on 02/14/2006 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE".

Trademark Details

Trademark form Word mark
File reference 78814687
Application date February 14, 2006

Trademark owner

1041 521 Corporate Center Drive
29715 Fort Mill
US

Trademark representatives

goods and services

22 fibers, namely, synthetic fibers, polyester fibers, and polyester stuffing fibers

ID: 1378814687