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The US trademark HY-BOND was filed as Word mark on 06/01/2005 at the U.S. Patent and Trademark Office.
It was registered as a trademark on 05/23/2006.
The current status of the mark is "REGISTERED AND RENEWED".
| Trademark form | Word mark |
| File reference | 3095467 |
| Register number | 78641278 |
| Application date | June 1, 2005 |
| Entry date | May 23, 2006 |
| Expiration date | May 23, 2026 |
Trademark owner
11 Kamitakamatsu-cho, FukuineHigashiyama-ku
605 Kyoto
JP
605 Kyoto
JP
Trademark representatives
2040 Main Street, 14th Floor
92614-7216 Irvine
US
goods and services
5
Pharmaceuticals
ID: 13