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The US trademark OMLPP was filed as Word mark on 03/22/2004 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".
| Trademark form | Word mark |
| File reference | 78388164 |
| Application date | March 22, 2004 |
| Publication date | January 4, 2005 |
Trademark owner
Bukit Minayak Taman Perindustraian Bukit Minyak Mukim 13
14100 Penang
MY
14100 Penang
MY
Trademark representatives
goods and services
9
Integrated circuit packages
40
Custom manufacture of integrated circuit packaging for others
42
Design of integrated circuit packaging for others
ID: 1378388164