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The US trademark CLAM SEALED PACKAGE was filed as Word mark on 08/15/2003 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".
| Trademark form | Word mark |
| File reference | 78287884 |
| Application date | August 15, 2003 |
| Publication date | December 7, 2004 |
Trademark owner
6 Takeda Tobadono-cho, Fushimi-ku
612-8501 Kyoto
JP
612-8501 Kyoto
JP
Trademark representatives
goods and services
9
HOUSINGS FOR ELECTRONIC COMPONENTS, NAMELY PACKAGES WITH OPTICAL FIBER CONNECTIONS FOR HOUSING SEMICONDUCTOR DEVICES, PHOTOSEMICONDUCTOR DEVICES, AND OPTOELECTRONIC DEVICES
ID: 1378287884