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The US trademark BUILT-IN PACKAGE was filed as Word mark on 06/06/2003 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED-FAILURE TO RESPOND OR LATE RESPONSE".
Trademark owner
711, Aza Shariden, Oaza Kurita, Nagano-s hi
Nagano
JP
Nagano
JP
Trademark representatives
goods and services
9
Package for integrated circuit, Circuit board, Circuit board equipped with integrated circuit
ID: 1378259341