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The US trademark DENSEPACK was filed as Word mark on 01/25/2002 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".
| Trademark form | Word mark |
| File reference | 78104816 |
| Application date | January 25, 2002 |
| Publication date | April 27, 2004 |
Trademark owner
201 NTU Innovation Centre, Nanyang Drive
637722 Singapore
SG
637722 Singapore
SG
Trademark representatives
goods and services
9
Photonic integrated circuits; multiplexers; wavelength division multiplexers; dense wavelength division multiplexers
40
ASSEMBLY OF PHOTONIC INTEGRATED CIRCUITS AND PHOTONIC INTEGRATED DEVICES FOR OTHERS; CUSTOM MANUFACTURE OF PHOTONIC INTEGRATED CIRCUITS AND PHOTONIC DEVICES FOR OTHERS; PACKAGING OF PHOTONIC INTEGRATED CIRCUITS AND COMPONENTS
42
PACKAGING DESIGN FOR OTHERS IN THE FIELD OF PHOTONIC INTEGRATED CIRCUITS AND PHOTONIC DEVICES; PRODUCT SAFETY TESTING IN THE FIELD OF PHOTONIC INTEGRATED CIRCUITS AND PHOTONIC DEVICES; TESTING, ANALYSIS AND EVALUATION OF THE GOODS AND SERVICES OF OTHERS IN THE FIELD OF PHOTONIC INTEGRATED CIRCUITS AND PHOTONIC DEVICES FOR THE PURPOSE OF CERTIFICATION; DESIGN FOR OTHERS IN THE FIELD OF PHOTONIC INTEGRATED CIRCUITS AND PHOTONIC DEVICES; SCIENTIFIC RESEARCH IN THE FIELD OF PHOTONIC INTEGRATED CIRCUITS AND PHOTONIC DEVICES; PATENT LICENSING AND LICENSING OF TECHNOLOGY IN THE FIELD OF PHOTONIC INTEGRATED CIRCUITS AND PHOTONIC DEVICES
ID: 1378104816