Logo (USPTO, 10/31/2008)
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The US trademark was filed as Figurative mark on 10/31/2008 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".
| Trademark form | Figurative mark |
| File reference | 77605300 |
| Application date | October 31, 2008 |
| Publication date | September 8, 2009 |
Trademark owner
6-3, Otemachi 2-chome
Chiyoda-ku, Tokyo
JP
Chiyoda-ku, Tokyo
JP
Trademark representatives
goods and services
1
Chemical preparations and agents used in the plating processes; copper sulphate; sputtering targets made of metal oxide, metal nitride or metal silicide for use in sputtering process of depositing a thin layer of metal oxide, metal nitride or metal silicide on substrates
6
Common metals, unwrought or semi-worked, for further manufacture; metal foil; stainless steels; foils and powder of copper or its alloys; metal sputtering targets; sputtering targets made of metal alloy for use in sputtering process of depositing a thin layer of metal alloy on substrates
9
Electrodes for use in sputtering process of depositing a thin layer of metal, metal alloy, metal oxide, metal nitride or metal silicide on substrates; semiconductors
ID: 1377605300