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The US trademark HRP was filed as Word mark on 05/05/2008 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".
| Trademark form | Word mark |
| File reference | 77465560 |
| Application date | May 5, 2008 |
| Publication date | April 28, 2009 |
Trademark owner
2-7-1 Hazawa, Nerima-Ku
176-8508 Tokyo
JP
176-8508 Tokyo
JP
Trademark representatives
goods and services
17
Electrical insulating materials for insulating coating or printing materials for use in the process of producing printed circuit boards, namely, insulating resin materials for use in the process of producing build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use in the process of producing build-up boards; insulating coating materials for use in the process of producing display panels; insulating solder mask for use in the process of producing printed circuit boards; interlayer insulation material for use in the process of producing build-up boards, namely, liquid resin, resin film, resin coated copper foil, and pre-preg; and interlayer insulation material for use in the process of producing printed circuit boards, namely, liquid resin, resin film, resin coated copper foil, and pre-preg
ID: 1377465560