RELIA-ALKALIFREE

USPTO USPTO 2007 ABANDONED - NO STATEMENT OF USE FILED

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The US trademark RELIA-ALKALIFREE was filed as Word mark on 08/03/2007 at the U.S. Patent and Trademark Office. The current status of the mark is "ABANDONED - NO STATEMENT OF USE FILED".

Trademark Details Last update: June 7, 2018

Trademark form Word mark
File reference 77247006
Application date August 3, 2007
Publication date January 29, 2008

Trademark owner

8248 Randolph Road NE
98837 Moses Lake
US

Trademark representatives

goods and services

1 Chemicals for use in alkali-free electroless metal plating process to fabricate metal films and patterns for integrated circuits, integrated circuit substrates, solar cells, flat panel displays, multi-chip modules, micro-electromechanical systems; precision analytical chemicals for use in analysis of alkali-free chemicals

ID: 1377247006